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Espressif’s newly launched ESP32‑S31 is positioned for next‑generation AIoT applications. As the successor to the ESP32‑S3, it introduces major upgrades in naming convention, architecture selection, and functional configuration, establishing itself as Espressif’s core flagship chip for the future with comprehensive improvements in overall capabilities.
I. Three Core Transformations of Espressif Chips
- Updated Naming Convention: New chips adopt a unified ESP32 + letter + two digits naming scheme (e.g., ESP32‑S31, ESP32‑H21), distinguishing the new product generation from earlier single‑digit naming for clear product segmentation.
- Full Architecture Transition: Complete migration from the Xtensa architecture to the RISC‑V architecture. All newly released chips are built on RISC‑V, marking a pivotal upgrade in technological infrastructure.
- Return of Classic Bluetooth: Emphasis on Bluetooth audio functionality. With the exception of pure smart home node chips, multimedia‑oriented products integrate Bluetooth audio, addressing a prior functional gap.
II. Core Highlights of ESP32-S31
The ESP32‑S31 integrates key advantages of the ESP32‑C6, ESP32‑P4, and ESP32‑S3, achieving comprehensive breakthroughs in performance, connectivity, and software to support diverse AIoT use cases.
(A) Performance Upgrade: High Frequency + Strong Computing Power + Rich Hardware Acceleration
- CPU: Dual-core 32‑bit RISC‑V CPU operating at up to 320 MHz, delivering 6.86 CoreMark/MHz. One core features a 128‑bit datapath with SIMD instruction support, paired with an MMU for efficient parallel data processing. A 40 MHz low‑power RISC‑V coprocessor is also integrated.
- Memory: Enhanced on‑chip memory includes 512 KB SRAM, 320 KB ROM, and 32 KB LP SRAM. Supports high‑speed expansion of 250 MHz 8‑bit DDR PSRAM, along with concurrent access to Flash and PSRAM. Multiple dedicated SPI interfaces (compatible with Octal SPI high‑speed mode) enable flexible external storage expansion. Combined with the wide SIMD datapath, the ESP32‑S31 is well‑suited for memory‑intensive and bandwidth‑intensive multimedia processing and AI/ML workloads at the edge.
(B) Connectivity: Full Protocol Coverage + Expanded Interfaces at a New Level for Espressif
- Comprehensive Wireless Compatibility: Supports 2.4 GHz Wi‑Fi 6 and IEEE 802.15.4, with compatibility for Thread, Zigbee, and the Matter protocol over Wi‑Fi and Thread. Integrates Bluetooth 5.4, supporting Bluetooth Mesh 1.1, Bluetooth LE Audio, LC3 codec, multi‑stream audio, and Classic Bluetooth (BR/EDR). (5 GHz Wi‑Fi is not supported.)
- Breakthrough in Wired Connectivity: First integration of a Gigabit Ethernet MAC and Gigabit Ethernet port, filling the gap in high‑speed wired communication.
- Rich Peripherals and Pins: The chip uses a QFN80 package with dimensions 8×8 mm and Offers 60 GPIO pins—the highest count among current Espressif chips. Supports an 8–16 bit DVP camera interface, 8–24 bit RGB LCD interface, and up to 14 capacitive‑touch sensing channels. Compatible with SPI, UART, USB OTG, SDIO, I²C, I²S, LED PWM, DMA, ADC, TWAI (compatible with CAN 2.0), timers, and other peripherals.
(C) Multimedia Capabilities: Powerful Multimedia Performance
The ESP32‑S31 delivers comprehensive human‑machine interaction capabilities, supporting an 8–16 bit DVP camera interface, multiple LCD interfaces (8–24 bit parallel display with hardware color‑space conversion), and up to 14 capacitive‑touch channels. Dedicated hardware acceleration units—including a JPEG codec, PPA 2D graphics accelerator, and 2D‑DMA—enable efficient image processing and display refresh.
For audio, Bluetooth 5.4 LE Audio supports high‑quality, low‑power audio streaming, while Classic Bluetooth (BR/EDR) ensures broad compatibility. Dual I²S controllers enable hardware‑synchronized Bluetooth audio for precise timing and ultra‑low latency, eliminating complexity associated with software‑based synchronization.
(D) Ecosystem and Security: Mature Framework + AI Enablement + High Security
- Full Development Framework Support: Compatible with Espressif’s official ESP-IDF framework, supporting ESP‑Matter and ESP‑BLE‑MESH. Can function as a connectivity coprocessor under ESP‑Hosted and ESP‑AT frameworks. Two new frameworks—ESP‑GMF (for multimedia applications) and ESP‑BLE‑AUDIO (for Bluetooth audio)—reduce development complexity.
- Enhanced AI Capabilities: Supports Espressif’s Private Agents platform, enabling direct collaboration with LLMs for development, execution, and interaction of AI Agent client devices.
- Comprehensive Security: Supports secure boot, Flash and PSRAM encryption, digital signature peripherals, and hardware‑accelerated cryptography. Provides resistance to side‑channel attacks and power glitch injection. Integrates a Trusted Execution Environment (TEE) with Access Permission Management (APM) for software isolation and secure multi‑application deployment.
III. Key Comparison Between ESP32 -S31 and Peer Chips
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- vs. ESP32‑P4: Slightly lower performance (320 MHz vs. 360 MHz, negligible difference), while the ESP32‑P4’s connectivity limitations. Uses MCU‑friendly DVP and RGB LCD interfaces instead of MIPI DSI/CSI, aligning its positioning closer to the ESP32‑S3. Supported by an official module, it offers stronger practicality.
- vs. ESP32‑S3: Delivers full‑scale upgrades including improved performance, the new RISC‑V architecture, more GPIOs (60), full‑featured Bluetooth, Wi‑Fi 6 support, and compatibility with Thread/Zigbee/Matter, with no critical functional weaknesses.
IV. Conclusion: Next Generation Blockbuster AIoT Chip
The ESP32‑S31 represents Espressif’s true next‑generation core chip, with versatile capabilities ideal for smart speakers, smart gateways, video doorbells, industrial automation, and other scenarios. It enables smoother UI experiences and enhanced computer vision capabilities, and is expected to become Espressif’s next blockbuster product.
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ESP32 S31 Datasheet and Technical Manual
